Strip Test For Semi-Assembly IC Product

At present, the rapid growth in demand for all kinds of electronic products, the annual demand for integrated circuit chip over billion, with all kinds of electronic products and high-capacity digital words, the demand for chips will be a substantial increase, while the IC substantial growth in shipments of chips, you need vendors to provide more refined at the same time, and thus the production of integrated circuits put forward higher requirements.This paper focuses on an integrated circuit test session, develop a new method for semi-assembly IC strip test, this method to improve testing productivity and reduce the cost of testing for the purpose. Through test principle analysis, summary test hardware requirements, test software environment settings, production processes, and the difficult problems that need to solve, investigate suitable for parallel testing of actual production methods and processes. The main content includes:1?Test condition study for semi-assembly IC strip test:Through the research of the process for Strip parallel testing, in particular to analyze the different of the test Strip in parallel between the traditional single test modes in production efficiency, to develop the most suitable conditions for Strip parallel testing.2?Test environment build and test methods implemented for semi-assembly IC strip test:Integrate the actual production environment; build the appropriate hardware and software testing environment, base on the research result to propose ways and means of Strip parallel test.3?Test process development for Semi-assembly IC strip test:Go through two different types of package types, SOP and QFN packages to develop different types of test strips process for assembly and test processes, innovative presented new method of manufacturing process in SOP package types add Trim process and QFN package types add Half-cut process.4?Test result analysis for semi-assembly IC strip test:Identify the test results and final product screening methods, for each process, specify the experimental method to determine the feasibility, setup a complete solution and applied to actual production.A new method for parallel test strips IC package of semi-assembly products, breaking the traditional mode of the finish assembly package then go to final product testing mode, semi-assembly strip test made innovative IC test mode, after the package molding process is complete, printing and singulation are not performed, insert to do Trim for pin separation, and then the product can be performance electrical testing in the lead frame. Breaking the traditional final test must be carried out to test the mold to achieve a real sense of large-scale testing, which greatly improved the production efficiency of the test process in large scale to meet the short-term market and large chip shipments requirements.