Analyze And Design On Signal Integrity Of High-speed Dynamic Memory PCB

With the popularization of smart device,the working frequency of electronic equipment is higher and higher.High speed dynamic memory is a required core circuit part of all intelligent devices,its performance largely influences the stability of the operating system.Based on the actual project,this paper designed a stable and modular DDR3(Double Data Rate 3,DDR3)high-speed dynamic memory PCB(Printed Circuit Board,PCB for short)which can be applied in product development directly.Some small smart device development company can use the modular PCB of high-speed dynamic memory directly in the product development process to leave complex PCB line routing and simulation process out.In this way,it can greatly improve the work efficiency and reduce development cost.Signal integrity is an important factor which must be considered when engineers design PCB of high speed dynamic memory.In the study of signal integrity problems,the signal reflection and crosstalk between signals are common problems.Through in-depth study of transmission line theory,the signal reflection theory and signal crosstalk between related theory in this paper,it established the mathematical model of signal reflection and signal crosstalk between signals for the feature analysis.According to the forming principle of the signal reflection and signal crosstalk between signals,this paper put forward target solutions.Taking the solution of the high-speed signal reflection and crosstalk as theoretical guidance,this paper completed PCB design of the high-speed dynamic memory.High-speed dynamic memory PCB design was simulated by using the SIwave and HSPICE simulation software and adjusted the PCB line routing according to the simulation results,optimized the PCB layout design.So it reduced the possibility of signal integrity problems during the PCB design process.It confirmed that the final design of high speed dynamic memory PCB had good signal integrity by measuring signals on PCB.And specific index of signal waveform is superior to design index.So the designed DDR3 high-speed dynamic memory PCB in this paper can be directly used in the actual product design to reduce the product development time and improve the stability of product system obviously.