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TXP Module Verification In Chip HOXC Based On Specman Elite

Posted on:2011-07-29Degree:MasterType:Thesis
Country:ChinaCandidate:J B TangFull Text:PDF
GTID:2178360302991272Subject:Software engineering
Abstract/Summary:PDF Full Text Request
With the increase of the complexity of ASIC (Application Specific Integrated Circuit), the workload of functional verification has increased multiplied. It is difficult to complete the functional verification of a ASIC which is in the scale of more than one million gates. The application of e language as a kind of HVLs (High-level Verification Languages) makes the functional verification more efficiency, especially in building a verification platform.To further improve the efficiency of verification, IC industry provide the commercial verification components (eVCs) based on e language. Because of their plug-in style, eVCs help verification engineers to complete verification platform with high efficiency. However, using intrinsic components and the usual method of verification can not well complete veification of various functions and protocol. When you verify some special function or protocol, you should modify the components for adapting to the veification requirements. According to this problem, this essay exploit a reused and allocated verification components structure which is improved on the basis of original method. Exploiting verification components and building verification platform about the txp module is a major task in the essay. The application of the platform is demonstrated the practicality of the modified verification method.
Keywords/Search Tags:ASIC, TXP, Functional Verification, e Language, e Verification Component
PDF Full Text Request
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