| An integrated circuit is a kind of microelectronic device processed by a series of special processes,which integrates all the designed circuits on a small silicon chip.Since 1958,after the world’s first integrated circuit was born in the laboratory,integrated circuits have been developing rapidly.With decades of evolution,integrated circuits have long left board-level circuits composed of transistor components behind in terms of size,weight,power consumption,lifespan,and reliability,and they have begun to race against themselves,opening an era of constantly refreshing their records.The research of this subject for integrated circuits is based on the Leon3 four core microprocessor.Leon3 has better data processing capabilities and is also the latest open source version of the Leon series today.Its multiple derivative versions are widely used in various fields such as aerospace and other countries in the world.The design of the thesis is mainly based on Synopsys’synthesis tool‘Design Compile’and automatic placement routing tool IC Compile.It describes the entire design process from the existing front-end RTL code to the back-end GDSII format layout file.First,this thesis discusses the timing analysis,power consumption composition,and design methods to effectively reduce power consumption for digital integrated circuits.In the design process,the chip is divided into four switchable block modules,the u＿m＿pd block module,and the leon3mp top-level module.It uses hierarchical technology and UPF technology to make the modules work in the 1.0V voltage area that can be turned off,the 1.2V voltage area that can be turned off,and normally open 1.2V voltage area.Using bottom-up hierarchical physical synthesis technology,it synthesizes block modules and creates block abstract models first,uses multi-instance module technology to reuse switchable block modules four times when synthesizing top-level modules,then inserts scan chains and clock gating units to complete Synthesize and generate a full-chip netlist.In the physical design process of floorplan,power-ground plan,clock tree synthesis,route to design for manufacturable,to continuous analyzing and correcting,attention is paid to various factors such as timing closure,on-chip variation,IR drops,crosstalk,and antenna effects.At the same time,in the physical design process,the use of hierarchical physical design,physical iterative synthesis,special-shaped floorplan,scan chain reorganization,macrocell interleaved power supply,clock mesh technology,and transparent interface optimization technology optimize the timing and area of the chip and reduce the iteration time.Finally,Complete formal verification on the Formality tool,and meet the static timing analysis of multi-mode-multi-corner under the distributed multi-scenario analysis of the Prime Time tool.In the end,through the fusion of multiple technologies,the SMIC55nm high-density process library is used to complete the Leon3 four core microprocessor design.At the same time,it achieves the following indicators:the total area is4149530um~2(1870um×2219um),the operating frequency is 166MHz,and the power consumption is 312.65m W.The sum of the maximum voltage drop and ground bounce of 1.2V and 1.0V voltage is 2.81%and 3.70%,respectively. |
