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Design And Verification Of TTC Array Signal Acquisition System Based On LabView

Posted on:2022-09-17Degree:MasterType:Thesis
Country:ChinaCandidate:H L SunFull Text:PDF
GTID:2518306323454864Subject:Computer technology
Abstract/Summary:PDF Full Text Request
Heating problem has become a bottleneck restricting the development of integrated circuit chip technology.Thermal test chips with local auto-heating and thermal measurement capability are designed to simulate the real hot scene when the chip works.It is an important link to build an array signal measurement system for the thermal test chip to solve the heating problem of the current high integrated chip,and is also the basis for studying the heat dissipation scheme.This thesis studies the thermal test chip of a multi-element array with heating resistance and temperature diode.Through theoretical analysis and experimental test,the working mechanism of the chip is discussed in depth,and the array signal acquisition system is designed and constructed.The system has certain theoretical scientific research and engineering application value.The main work and achievements are as follows:(1)Describes in detail the thermal test chip internal structure layout,The heat transfer mechanism of the heating resistance unit is analyzed and the total heat exchange equation of the chip under the heat balance condition is constructed,the experimental measured unit and power density of up to 5400W/cm~2,the theory of temperature can reach 400?above,analysis of working principle of the temperature measuring diode,experimental verification under the constant current source of 0.1mA,voltage-temperature coefficient of about 0.4?/mV.(2)Design of the lower computer hardware acquisition system for thermal test chips,including master control,stabilized voltage supply,steady current source chip type selection,strobe circuit and amplifier design.(3)Construct the upper computer software acquisition system based on LabView,complete communication,drive heating and temperature test with lower computer acquisition,and include array non-uniform calibration,data processing,visual display,storage,back reading and database log management.The system is verified by comparing with the simulation results and data measured by thermocouple temperature sensor.The results show that the temperature deviation is below 0.3?,which verifies the reliability of the system.
Keywords/Search Tags:Sensor, Thermal Test, LabView, Data Acquisition, Readout Circuit
PDF Full Text Request
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