Study On The Improvement Of The Bending Stiffness Of The Dicing Blade Based On Six Sigma DMAIC

In recent years,China's IC design,manufacturing,packaging and other industries continue to grow under the support of national policies.With the rise of consumer electronics,smart cars and other fields,the demand for semiconductor related products continues to rise,promoting the rapid development of China's semiconductor industry.Dicing blade is mainly used for slotting and cutting in the manufacturing process of semiconductor integrated circuits and discrete devices.The main dicing materials include silicon wafer,Ga As wafer,glass,ceramics,quartz,semiconductor composite materials,etc.There are many quality problems in Z company's dicing blade products,such as high blade damage rate,kerf snake bend and groove inclined,which seriously affect the customer's use experience and slow market promotion.In this paper,the dicing blade are taken as the case study object,the bending stiffness of the dicing blade is taken as the objective of quality improvement,the Six Sigma DMAIC five step analysis method is used as the system flow.First,through the comparative analysis with the similar products of foreign competitors,the current situation of Z company's dicing blade products is clarified.Then,the main influencing factors of the dicing blade's bending stiffness are analyzed by fishbone diagram and cause and effect matrix.Then,the methods such as DOE experimental design,Minitab data statistical full factor analysis and variance analysis are used to find out the electroplating The optimal solution of process parameters is obtained and improved according to the parameters.In this paper,the process capability analysis,variance analysis,T-test and other methods are used to compare the bending stiffness of the dicing blade before and after the improvement of Z company,and the improvement effect is evaluated quantitatively.At last,the improved electroplating parameters were standardized and monitored in real time through SPC control chart to ensure the sustainability of the results and improvement.In this paper,through the improvement of the main factors that cause the low bending rigidity of the dicing blade,we find out the process and method to determine the bending rigidity of the dicing blade and the stability control of mass production.Finally,we can ensure that the bending rigidity of the dicing blade products of Z company can reach the index requirements of more than 6.0 gf/10?m,and there is no difference with the application quality effect of the same specification products of DISCO company.This paper deeply discusses the application and promotion of Six Sigma DMAIC analysis method in semiconductor industry through empirical research method,gradually finds out the mode suitable for the implementation of Six Sigma in dicing blade production enterprises,improves the product quality,market competitiveness and customer satisfaction of the dicing blade,expounds the importance and necessity of implementing Six Sigma management method,provides reference value for the application of Six Sigma management method in the dicing blade industry.