The Study Of Wafer Blade Dicing Effect On Die Quality

3D ultrathin wafer is getting more and more attentions due to its excellent performance and the request of high integrate package.However,with the wafers become thinner and thinner,the die strength is becoming lower,and the risk of damage that induced by process is increasing,and then the reliability of products can be affected.So there are higher requirements to the process technology of 3D ultrathin wafer.With the application of 3D wafer is more and more wildly used,the breaking strength of die has become an important parameter for IC assembly.With IC technologies evolving,many new materials and new process are used for the manufacture of silicon wafer which bring out great challenges for wafer sawing and thinning.During the wafer processing,wafer grinding and saw are both important process steps which have significant influence on die quality.Wafer dicing is a mechanical process of removing material from a wafer by abrasive particles-usually synthetic diamonds.The tool is a thin circular blade made of a nickel matrix that holds the diamonds.With IC technologies evolving,many new materials and new process are used for the manufacture of silicon wafer which bring out great challenge.Chipping is very difficult to be controlled at wafer saw process.For wafer saw,there is a variety of modes at present stage,different dicing modes are appropriate for different wafers.For blade dicing,chippings may be induced because of the blade can't keep adequate cutting ability,chipping size influence the dicing quality.It has been found that chipping size can be affected by diamond concentration,grit size and bond type,the processing parameters such as spindle speed and feed speed also have influence on chipping size.In the paper,the mechanism of chipping during the dicing process was studied,blade can't keep enough dicing ability is the key reason leading to chipping,dressing after dicing for some distance can avoid serious chipping,dicing 10 m can obtain best dicing quality which has nearly no chipping.The correlation between spindle speed/feed speed and dicing quality was studied,there were five groups of experiments in total to validate the effect of spindle speed and feed speed.Feed speed was fixed when the effect of spindle speed was studied and the spindle speed was fixed when the effect of feed speed was studied.Chipping sizes data were collected by optical microscope and scanning electronic microscope,die strength was measured by three-point bending test,and the data analyzed by JMP.25 die strength values were get from per wafer.45 k is the best spindle speed which can get best dicing quality and highest die strength at 426.38 MPa compared with 40 k and 50 k.70mm/s is the best feed speed which get highest die strength at 435.69 MPa compared with 50mm/s and 60mm/s.