Research On Cutting Process And Technology For PLC Splitter

Planar Lightwave Circuit (PLC) splitter is the central unit in the Passive OpticalNetwork (PON). The main component of its chip is silica, just like glass, stone andceramic, it is brittle material. This material has good wear resistance, corrosionresistance, acid, alkali and other features. However, due to its brittleness and highhardness, easy occur shatter and fracture during the cutting process, so the processingmechanism is more complex than ordinary materials. During cutting process, it iseasy to cause chipping defect on the surface, and seriously affect the quality andyield.The thesis will study the cutting technology for PLC splitter chips. Firstly, Itpoint out the problems exist on current cutting process then analyze the reason. In theend, a effective way is raised to improve the dicing blade life and reduce defect rate.This study is carried out on a hard and brittle materials processing center of MTINSX-180precision grinder. Orthogonal experiment was used to study the impact ofthe machine process parameters on dicing blade wear. The experiment results showthat the cutting results are influenced by the machine process parameters, includingthe machine spindle speed, the PLC chip feed speed, and cooling water flow in thecutting process, the dicing blade wear will decrease with the increasing of spindlespeed and cooling water flow, but increase with the increasing of the feed speed.In the experimental study of dicing blade life and cutting performance, theresults show that the main parameters affecting the life of diamond tool including thediamond size, density and bonding material, among them, the bonding material is themost important factor, then are the diamond size and density.Base on experiment and analysis, by optimizing the machine parameters andselecting a suitable diamond tools, diamond tool life is significantly improved from150to nearly300; and defect rate is reduced from2.1%to about0.8%.