The Application Study Of Six Sigma Approach On Quality Improvement Of SMT Reflow Process

Since the 1960s Electronic Circuit Surface Mount Technology (Surface Mount Technology, SMT), after 50 years of development, has entered the mature stage, SMT for the further miniaturization of electronic products, thin and light weight opens up broad prospects received in the last 20 years, rapid development and application, and is toward higher density, the direction of ultra-miniature development. SMT components of the package towards highly integrated, high performance, multi-lead, narrow spacing in the direction of diversification and the development of one of the key technology of assembly reflow soldering process raised a strict requirement that both the weld contacts to form a reliable electrical and mechanical connection, neither make smaller and thinner printed circuit boards to put too much distortion, nor make smaller and smaller, more integrated components to withstand high heat damage.Quality control of reflow soldering of the most critical is the control of the profile of their reflow, often affect the structure and solder joint reliability. Reflow soldering profile for the parameter values, PCB product features such as integrated output effect, showing diversity of their needs and high complexity. After the traditional trial and error, repeated adjustment to determine the method of reflow soldering temperature profile of the increasingly unable to meet this requirement, or even to complete the set temperature curve. Meanwhile, the traditional time-consuming and expensive method of financing a large number of experimental, electronic products can not meet the current update speed, the needs of an increasingly competitive.Six Sigma DMAIC this improved method to the main line, first introduced the research background and significance, next introduced the theory of Six Sigma methods; in theory, based on the SMT reflow process to analyze the quality of research. Defined to enhance the reflow process to improve the quality of the ultimate goal, to ensure the measurement system (Reflow Oven, and surveyors) stable, acceptable, based on the reflow temperature curve of the present position when the process capability analysis, a clear improvement in the specific direction. Analysis stage multiple regression analysis the independent variables, looking for significant factors to improve process capability. Significant factors on the combination of experimental design to find optimal parameter settings to optimize the reflow furnace temperature-time curves of the PWI value from 120% to 60%, SMT reflow process quality, achieve customer satisfaction, enhance the core competitiveness of enterprises. The real X company on the implementation of Six Sigma projects, established a quality suitable for SMT reflow process quality and volatile factors and more quality control and quality improvement model.