Experimental Research On Improving Properties Of Composite Electroplated Diamond Dicing Blade

In process of fabricating integrated circuit, a key technique is to separate the integrated circuits on the silicon wafers. As the principal tool for dicing silicon wafer, diamond ultra-thin dicing blade is sophisticated, accurate, high efficiency and used widely. Refer this kind of blade, diamond powder is buried in about 50mm of diameter and 20-25μm of thickness planchet of resin or metal. Motheds of fabricating the kind of blade include powder metallurgy die-casting, electroforming and composite electroplateing which is the important one to fabricate hub type diamond ultra-thin dicing blade. At present, the technology of manufacturing diamond ultra-thin dicing blades is relatively backward in China and the requirement depends on import from other countries. This paper bases on summarizing the development of interrelated technology of home and abroad, aims to fabricate diamond ultra-thin dicing blade and improve its properties and then researches on the systemic fabricating methods and fabricates prototype workpieces.Quest of composite electroplating process of hub type diamond ultra-thin dicing blades is one of the focal points of the study. Traditional substrates of composite electroplating are iron and copper, while the substrate material is aluminum alloy in the research. Therefore, a lot of factor experiments are carried out to indagate electroplating process on aluminum alloy substrates. Then the technics of preliminary treatment of the especial substrate and composite electroplating are summarized. According to the results of the experiments, composite plating layers for diamond dicing blades are fabricated successfully. It confirms the feasibility of the aforementioned method.Corrosion of aluminum alloy substrate and plating layer is another focal point to fabricate diamond dicing blade. As the plating layer adheres to the substrate everywhere, substrate must be removed by selective corrosion to expose the blade. Electrolytic etching is used to remove the part of aluminum alloy and dress the layer after investigating various methods of metal removal. In order to make plating layer maintain good mechanical properties, the electrolyte composition, current intensity, voltage and the space between electrodes must be investigated in the experiments. Then the equation between corrosion rate and the parameters is summed up. The diamond dicing blade with good properties can be obtained after etching the part of aluminum alloy using the electrolyte and electrolysis technics parameters from the research on the self-repair electrolytic machining equipment. In order to investigate the dicing properties of the diamond blades, experiments of dicing silicon wafers and glass fibre reinforced plastic are carried out on the dicing machining equipment. The properties of blades such as service life and degree of misregistration can be obtained by indagating its wear and scratches of silicon wafers and glass fibre reinforced plastic. Blades maintain sharp shape, have few warps and little deformation after the experiments. The results show that the method of using composite electroplating technique to grow composite plating layer of diamond and nickel on aluminum alloy substrate, then etching the substrate by electrolysis process is feasible and effective to obtain diamond ultra-thin dicing blade and improve its properties.