A Research Of CMOS Image Sensor Dynamic Burn-in Test System

CMOS image sensor developed very rapidly in recent years. It has been applied to a great many fields such as astronomical observations, aerospace, digital cameras, industrial and medical. However, as the CMOS image sensor application field widely,also put forward higher requirements for its reliability. Due to the structure, process and other reasons, there will be inevitable defects In the CMOS image sensor manufacturing process. It is necessary to take effective reliability screening test for image sensors. Dynamic burn-in test as one of the common test method of reliability test, it can effective flip the circuit internal nodes.Therefore,the CMOS image sensor for dynamic burn-in tests are effective,appropriate test methods.We designed a CMOS image sensor dynamic burn-in system for DS-lx-01M28 image sensor dynamic burn-in tests. The most outstanding advantages of the system are high efficiency,high stability and monitored in real time. The main researches including:Introduce the related basic knowledge of integrated circuit reliability and burn-in tests.Mainly about integrated circuit reliability theory, burn-in test basic theory, burn-in test stress and precautions.Introduce the structure, performance and working principle of the CMOS image sensor,especially about the image sensor of this system used.Design dynamic burn-in test system plan Based on the methods of the dynamic burn-in test and the characteristics of the burin-in test image sensor. The burn-in test control board as the core part of the hardware platform. The way of system working used burn-in test control board combination with PC.Detailed introduce the system design process, including the design of the design, FPGA software and PC monitoring software.Burn-in test the CMOS image sensor used the designed dynamic burn-in test system, and analyzed the test results after the end of the experiment.