A Design Of The Modularized High Temperature Dynamic CMOS Image Sensor Aging Device And Analysis

With the development of semiconductor technology,CMOS image sensors in the solid state sensor play an increasingly important role,with awide rang of applications.CMOS image sensors are ubiquitous in daily life,from smartphones,digital cameras to medical equipment,from industrial monitoring camera to star sensor,marine and aerospace Space Science.In the CMOS image sensor application market in the field of high-reliability,its reliability is highly demanding.However,in the manufacturing process,due to the structure and technology,flaws in the CMOS image sensors are inevitably.To ensure that the devices can be put to use in such field of high reliability,as military,aerospace,etc.,the reliability of the devices must be assessed at first.Aging is an important method to assess the devices.Therefore,Aging Research in the design of CMOS image sensors is necessary.This paper is aimed at design a modularized high-temperature dynamic CMOS image sensor Aging device,and V1T1X30 image sensor are tested in dynamic Aging experiment.This Aging device can monitor real-timely,with high Aging efficiency,flexible applications,high stability and reliability.The contents are listed as follows:IC reliability and the basic theory of aging.The basic theory of Aging.The basic theory of the CMOS image sensor: the structural features and workingpatterns.According to the image sensor performance,based on the dynamic Aging testrequirements,we completed the design of the high-temperature dynamic Aging device.The device includes Aging module,incubators and so on.Aging process module design.The completion of the design of the modularized high temperature dynamic CMOSimage sensor Aging device and the analysis of results.