Technical Research On Burn-in Screening Test Of Military Integrated Circuit

With the rapid development of semiconductor technology, the market demandcontinuously puts the performance of products to its technical limitation, so theimportance of integrated circuit reliability test appears gradually. As a necessaryreliability test of military integrated circuit, burn-in screening test is a important factorrelated to the reliability application of military integrated circuit. Therefore, carrying outmilitary integrated circuit burn-in screening technology research has high practical value.This study is based on engineering production, designed to deeply understand themechanism of the burn-in test by researching military integrated circuit burn-in screeningtest, bring the results of technology research into the test plan and experimentalimplementation of specific circuit, combining theory with practice, to obtain the validityand reliability of burn-in screening test，to eventually improve the reliability of militaryintegrated circuit. In this paper, we take the reliability test theory of military integratedcircuit as a foundation, combining with the demand of military integrated circuitproduction practice, research the burn-in screening technology as follows.First of all, in the basic theory, from the reliability test perspective, we exploredburn-in test standard and a variety of test and the basic theory and characteristics ofburn-in test. Second, in order to solve practical work demand, we researched on thegenerality topics existing in the practice of work, finally realized and solved the burn-intechnical problems, such as latch-up avoiding, electric connection test, aging boarddesign, aging resistance selection etc. Finally, based on the test results of burn-in test,combined with the requirements of the engineering practice, we designed three kinds ofburn-in test plan of typical military integrated circuit, such as military SOC, militarymicroprocessor, and military FPGA, and apply the test scheme to the engineeringpractice, to solve the engineering application problems such as burn-in high failure rateof SOC products, burn-in low coverage of FPGA products and microprocessor etc.