| With the rapid development of smart phone industry in recent years,an increasing number of applications were integrated into a single mobile device such as smart phone and tablet,in order to better meet the customer’s requirement.Therefore,there are lots of different interface between the microprocessor and the peripherals in a mobile device,and it will delay the progress of product development.In 2003,ARM,Intel and Nokia set up an organization called MIPI Alliance,which aims to develop interface specifications for the mobile ecosystem.The organization has developed more than 45 specifications within the mobile ecosystem in recent years,and these specifications all share the same physical layer interface.MIPI Alliance PHY working group has sucessfully launched three physical layer specifications,that is D-PHY,M-PHY and C-PHY,and M-PHY was the most widely used physical layer.The design and verification of M-PHY physical layer digital system has been introduced in the thesis.First,The MIPI M-PHY physical layer specification was introduced,and the hierarchical structure of MIPI interface based on M-PHY was given.Then,the charateristics of M-PHY and the structure of physical layer,which based on the description of M-PHY specification were analyzed in this thesis.The physical coding layer(PCS)of M-PHY has also been introduced and discussed in this thesis.The digital implementation scheme and the structure diagram of PCS were proposed.The design of PCS submodule is the emphasis of this thesis.According to the structure diagram of PCS,the key modules of PCS consist of M-PHY TX/RX_FSM module,8b 10b encoder/decoder,tx/rx configuration module and MKO detector.The M-PHY PCS design was RTL coded utilizing Verilog HDL.Besides,a Built In-Self Test(BIST)which is used in simulation and verification of high speed serial interface has also been introduced in this thesis.The simulation and verification of this design were conducted by using Synopsys VCS sinmulation enviroment.The simulation of PCS,M-PHY physical layer and BIST loopback were conducted,and the simulation results conform to the MIPI M-PHY specification’s requirement.The MIPI M-PHY physical layer IP was fabricated in SMIC 28nm teconology. |