Research On Electromagnetic Compatibility Of T/R Module Based On System-in-package(SIP) Technology

With the rapid development of electronic technology, electronic product design increasingly focused on miniaturization and high reliability. System-in-Package(SIP) technology can integrate different material devices and rational use of the three-dimensional space. This technology became the trend of studies at home and abroad because the advantages of design flexibility, small size and high reliability. Because the T/R module based on SIP technology integrate active and passive devices into small space, mutual influence between devices can’t be ignored. In this thesis, the electromagnetic compatibility of T/R module based on SIP technology is researched.The causes of electromagnetic interference are analyzed firstly in this thesis, the three elements of electromagnetic interference are interference source, coupling paths and sensitive devices, and three commonly used methods to suppress EMI noise are grounding, shielding and filtering. Secondly, by analysis of the reasons for crosstalk between the transmission lines in the multilayer, and then introduce three methods to decrease crosstalk between the transmission lines: one is increase the space distance between the transmission lines, the other two are place metal grounding holes and grounding lines between the transmission lines. Placing grounding lines between the transmission lines can get the best suppress effect of crosstalk when the space distance is same. By comparison with the performances of four different types of the transmission line corners, the type of 45-degree miter angle can get the best performance. It can be analyzed that the performances of transmission line corner will be better by placing metal holes around it from the simulation results. Split power / ground plane can affect the transmission performances of microstrip, Placing metal or capacitors in the slot under microstrip can improve the performances of transmission. Engineering experience is important for the EMC design because of the EMI creation is uncertain. We summarize and analyze the electromagnetic problems that we may encountered through the design and debug of U-band tunable signal source, and introduce the design of grounding, shielding and filtering in T/R module based on SIP technology. The process relates to the viability of the design of T/R module, this thesis introduce the process of multilayer, and analyzes the impact on performances due to the processing errors. The layout design of T/R module combined with process is introduced. By comparing the two different designs of structural, the transmission branch and reception branch are placed in the uppermost and lowermost layer of the multilayer, and metal vias are the signal paths transmission between the transmission branch and reception branch, filter capacitors in DC bias can suppress the coupling interference from the power lines effectively. Finally, we design and test the transmission branch and reception branch separately. It can be seen that performances of reception branch are not stable from the test results, the causes of this may be that designs of shielding are bad, so we will strengthen the shielding design in next design.