Research On PCB Electromagnetic Compatibility Of Wireless Communication Module

Over the last decade, wireless communication technology has completely changed the way humans interact with the world. It can be predicted that this effect will be more significant in the following long period of time. Definitely, the two research orientations which are the strongest driving force, are the Higher Speed Wireless Internet Access and Wireless Sensor Network. However, the implementation of both has to be established on the basis of successful design of reliable wireless communication module PCB. Such a high-speed, small size RF module which contains both digital and analog circuits has the problem can not be ignored, namely Electromagnetic Compatibility.Faced with the PCBs of a wide variety of electronic systems and the faster clock frequencies, high-speed PCB design methods have draw extensive attention and in-depth study by professional engineers. Based on the analysis of electrical parameters of electronic systems and signal integrity, this paper study with the Electromagnetic compatibility of high-speed PCB. Begin with the study of electromagnetic theory, in-depth research has been done on board-level signal integrity issues of electronic system. The theoretical analysis of various types of interference that may occur in modules and the corresponding solutions are proposed. In addition, all interference and solutions are validated by using simulation software. In the course of the study, CC2530based wireless communication module is selected as design object. Parameters and model features of the key parts of design such as antenna, RF front-end and differential impedance matching are analyzed in detail. Throughout the design process, signal integrity design requirements are fully considered and in-depth analyzed. Electromagnetic simulation software such as HyperLynx, ADS, HFSS and SigXplorer have been applied in assisting analysis and design. Ultimately, the PCB of module is produced and a satisfactory test results is obtained. The test result shows that the module has power dissipation of4.0mW, receiver sensitivity of-97dBm and the reliable transmission distance up to250meters.On the basis of full consideration on signal integrity issues, the design is completed. The research methods have certain guiding significance on the design of higher complexity and higher speed wireless communication modules in the future.