Thermal And Electromagnetic Compatibility Design For High-speed Optical Module Based On Micro Structures

The optical network has played an important role in the current communication system because of its advantages of high speed,high stability and the huge bandwidth resources.As the core components of the optical network,optical modules have also become a hot research topic.The trend of miniaturization and integration of optical modules has led to an increasingly prominent problem of thermal dissipation and electromagnetic compatibility(EMC)within the module.In this thesis,the following researches are carried out:(1)The thermal environment and the internal heat dissipation path of the high-speed optical module are analyzed and the thermal resistance model is established.The internal structure and component functions of the high-speed optical module are summarized;the thermal environment and internal heat dissipation path of the high-speed optical module are systematically analyzed;the thermal resistance model of the high-speed optical module is established by the equivalent thermal network method.(2)Thermal designs based on microchannel,graphene and micro-pool,vapor-liquid phase change structure for high-speed optical module are proposed.The air flow traces inside the optical module are analyzed and the component layout is optimized;the straight microchannel and?-type microchannel is proposed;the heat dissipation holes are used to improve heat exchange;heat dissipation structure based on graphene and micro-pool is proposed;vapor-liquid phase change structure is proposed.(3)The electromagnetic environment of the high-speed optical module is analyzed and the EMC design based on the array waveguide ventilation plate is proposed.The electromagnetic interference(EMI)problem of the optical module brought by the heat dissipation holes is studied.The array waveguide ventilation plate is used to enhance the EMC performance of the optical module.(4)The proposed thermal and EMC designs are numerically verified by EDA tools such as Solidworks for the former and HFSS for the latter.The thermal optimization design based on the microchannel structure improves the heat dissipation capacity and the temperature difference of the component inside the optical module:when the cabinet wind speed is 5m/s,the maximum junction temperature in the optical module is reduced from 259.73?to below130?;when the coolant flow rate is higher than 3×10^-5kg/s,the temperature difference of the module is stabilized within 8?;when the coolant flow rate is higher,the performance of the?-type microchannel is significantly better than the straight-type microchannel.Also the heat dissipation holes,graphene and micropools take great effects for heat transmission and transfer in optical module.As for the EMC verification,the electromagnetic shielding effectiveness is greatly improved from 83d B to 163d B by using the array waveguide ventilation plate;the more sparse the array waveguide distribution,the better the electromagnetic shielding effect.Facing the heat dissipation and the EMC problem of high-speed optical modules,we carry out the thermal and EMC design,which not only reduces the junction temperature of the inner components but also guarantees certain anti-EMI performance.The research could supply the theoretical foundation and engineering prototype for the thermal and EMC management of the high-speed optical module or other electronic equipment.