Research On High-Frequency Packaging Technology Of High Power Semiconductor Laser

The high-speed semiconductor laser is a key device of laser communication and radar. The packaging technology limited the stability of the output optical signal and the cooling performance of semiconductor laser. Therefore, research on high-power semiconductor laser packaging technology in high-frequency modulation is of great significance.In this paper, the research work includes two aspects, the high-frequency parasitic and the thermal effects. In the aspect of high-frequency parasitic, a high-frequency parasitic circuit was established by the software of Pspice. The frequency response of output light signal was simulated of different values of the parasitic parameter.In the aspect of thermal effects, a C-Mount package semiconductor laser model was established in this paper, and thermal characteristic of different kinds of heat sink materials was simulated by the finite element software ANSYS. The temperature distribution of high frequency semiconductor laser was subsequently simulated. Then Cu was selected as the heat sink, and In or AuSn was used as a solder, and the thermal stress distribution and thermal deformation of different solder materials were analyzed. Finally, selected A1N as the transition heat sink for further optimize design of the thermal characteristics of the C-Mount type semiconductor laser.