Study On Packaging Technology Of High Power Semiconductor Laser Based On Diamond Film Heat Sink

The thermal characteristics of high-power semiconductor lasers have a big impact on its performance. The key to solve thermal problems is to design a reasonable method of packaging. This paper research the packaging technology of semiconductor laser to improve the cooling effect by addition of the diamond film transition heat sink.In this paper, the808nm VCSEL(Vertical Cavity Surface Emitting Laser) is as an object. Research the basic principles, heat transfer theory, the preparation process and packaging technology of VCSEL based on diamond film heat sink. According to the packaging structure of808nm VCSEL array, build the three-dimensional model. Research its thermal characteristics by the method of ANSYS finite element. Simulate the temperature distribution and thermal stress distribution under different thermal conductivity, thickness and solders of diamond film transition heat sinks. A diamond film transition heat sink with thermal conductivity of1800W/(m·K) and thickness of500μm can decrease thermal conductivity of about35%compared with copper heat sink and can decrease thermal conductivity of about40%compared with A1N transition heat sinks. The thermal stress is small when it is working. It reflects that the diamond film heat sink used in the package of high-power semiconductor lasers have obvious advantages.