Research On Packaging Technology Of 808nm High Power Semiconductor Laser

As a core component of laser processing technology,high power semiconductor lasers,its packaging and preparation technology is a very important link.Package quality directly affects the spectral parameters of the laser,photoelectric parameters,reliability and working life.In order to reduce the thermal stress,improve the heat dissipating performance and improve the packaging quality,808 nm single-tube semiconductor lasers are used to study the heat sink,solder,encapsulation steps and process parameters of semiconductor lasers.The main work is as follows:1)In order to match the size of 4mm × 0.5mm GaAs laser chip,the transition heat sink and the base heat sink for the material selection and structure design.In order to reduce the stress of the laser package and improve its heat dissipation,the material selection of the solder for chip welding and the transition heat sink sintering is carried out.The location of the chip surface was investigated to reduce the produced of COD(optical catastrophic damage).2)Design packaging process steps,analysis and select the packaging process,initial set the process parameters.3)Compare the SEM(scanning electron microscopy)image of the chip with the different process parameters,the laser's shearing force,the photoelectric parameter and the thermal stress.The thermal resistance and junction temperature of the packaged laser are calculated under the ideal process,and the working life of the laser is estimated by accelerating the aging.