Resrarch On The Thermal Characteristic Of Long-Cavity、Wide-Bar Semiconductor Laser

The thermal characteristics of high-power semiconductor lasers can make full impact on its many performances, Analysis and research of thermal is the important research topics to improve the device power、to increase the device lifetime and so on. We derived temperature rise formula form the theoretical and find the key factors that affecting the temperature rise:Aspects on optimizing the body resistance RC and the thermal resistance RT of long-cavity、wide-bar semiconductor laser in this paper, After the research and experiments of laser’s production process, we optimized the ohmic contact process.After learning and studying the software of ANSYS12.0. analyzed the welding of AuSn、iN、SnPb solder to the affecting of working laser’s temperature and thermal stress, provides a theoretical condition for the device package:using AlN as the second heat sink and welding with AuSn solder is an increase of laser’s thermal characteristics and its life. Summary of experience that packaging in the laboratory, to package and test the long-cavity、wide-bar semiconductor laser.