Analysis And Research For The Thermal Characteristic Of The Semiconductor Laser

The thermal character of the semiconductor laser can make a full impact on its much capabilities straightly. Analysis and research for the thermal character is an important studing content in the chip developping, device packaging even coupling of the semiconductor laser. Based on concluding the packaging technology of the semiconductor laser, we pakeged 3 C-Mount lasers used AuSn solder , In solder and AlN transition heat sink individually in this paper. Then, from the heat transfer theory and it's finite-element method, we individually calculated their steady-state thermal resistance after testing their parameters such as spectrum etc. we have compared these hermal resistance mostly from the packaging angle. Finally, we made a steady-state or transient-state simulation for these 3 semiconductor lasers by ANSYS finite-element software, and got their thermal distribution nephograms. By these nephograms, we c alculated their steady-state or transient-state simulation thermal resistance. Only for the thermal conductivity angle, the final comparison shows that the thermal character of the In solder packaging semiconductor laser is best, and of AlN transition heat sink packaging semiconductor laser is most bad.