Study On The Heat Disspation Of High Power Semiconductor Laser Arrays

One of the key problems is lasers cooling in researching high power semiconductor diode laser arrays. In order to increase the output power, reliability and stabilization, microchannel heatsink which is one of active heatsinks is used to cool high power semiconductor diode laser arrays in the paper. According to heat transfer and hydrodynamics, the thermal flow dynamics and the thermal resistance microchannel heatsink are analyzed. Based on the analysis, the heat sink materials, cooling liquid, the heatsink structure, and the bonding of laser bar are optimized in order to increase the transfer efficiency. Considering the practical manufacturing condition, an Oxygen-free copper microchannel heatsink consisting of five copper sheets is designed and fabricated utilizing the technology of deep photolithography, mechanical machining, and bonding with medium. By testing, the total thermal of the microchannel heatsink for cooling high power semiconductor diode laser arrays is 0.645℃/W, which is consistent with the result of theory counting.