Analysis Of Signal Integrity Of High-speed Circuit Design

With the increasing of the frequency of integrate circuits, the varying rate of signal, aswell as rising edge and falling edge, has increased rapidly. Signal integrity (SI) problemhas become one of main problems in high-speed PCB design. The problem caused by somefactors, such as parameters of devices and PCB, layout of devices on PCB and trace ofhigh-speed signal, etc., results in the unstable problem or even non-operation of system.How to fully consider SI and take effective measures to solve the problem has been amajor task in PCB design.This paper introduce SI problem of high-speed PCB design. We analyze the causes offour specific noise sources giving rise to defined as the SI problem and proposecorresponding solutions theoretically. After introducing the IBIS model, Mentor’sHyperLynx software was used to simulate the SI problem including reflection, crosstalk,etc. Having fully considered the SI, we can design the PCB layout more in line with therequirements with appropriate analytical methods in strong EDA tootls, and the PCBsystem board is more stable and reliable. New high-speed PCB design method can shortenthe developing cycle and reduce costs. It further indicates that the SI analysis is importantfor high-speed PCB design.Through studing the theory of VIA, HyperLynx software was taken to simulate theequivalent circuit and we concluded that impact of VIA in high-speed circuit design isinevitable. With the existence of VIA, only better parameters setting of VIA and the boardlayers can solve the SI problem. Applying HyperLynx software tools, We simulated theexample in detailed. It further demonstrates the effects and impacts of SI problem inhigh-speed circuit design.