Study And Design Of Hign-speed Circuit For 10-Gigabit Small Form-factor Pluggable Transceiver

Traditional backbone network (including LAN, WAN, etc.) capacity can not meet today's demand .With the ever-growing popularity of broadband access and Data and voice, video, images and other multimedia integrated business' flourish . So, we need to develop a greater transmission capacity, lower prices and more efficient transmission of optical network .Based on this situation,a series of standards of 10 Gigabit optical network are developed . Therefore, related technology of 10G optical devices, optical modules and optical transmission systems are developed.The module is a hot pluggable small footprint serial-to-serial data-agnostic multirate optical transceiver, intended to support Telecom (STM-64,G.709 "OTU-2") and Datacom applications (10 Gb/s Ethernet and 10 Gb/s Fibre Channel). There is no SerDes in the module .The electricial interface of XFP is XFI (data rate of different signal is 10Gbit/s)which support all data encodings for these technologies.XFP is characterized by los-cost,miniaturization, pluggable and self-diagnoses.At present,XFP is considered as the most promising 10G optical module.Since it requires to integrate optical detector, optical amplifier, optical transmitter, driver and various warning and monitoring control circuits within a small area, however, the difficulty increases correspondingly .With data rate up to 10Gbit/s,it is necessary to consider a serial problems (such as Signal integrity, power integrity and EMC, etc.) in hign-speed digital design.The main issue in the project are as follows:1,The paper researches and analyses the signal integrity, power integrity and other correlative theory in high -speed circuit , and discusses the device model and design tools , which used in simulation design of high-speed digital circuit. And design methods and processes of XFP are also proposed.2,Based on the analysis and discussion of XFP MSA and key technologies,The author proposes a complete XFP project, and completes the hardware circuit design by using simulation and design methods. 3,The author complete the eight floors of the PCB board's simulation and design by using Cadence.4,This issue's features is the analysis of SI runs through in the entire process of project design. SI and PI problems must be considered not only in idea design,device selection and schematic design stage,but also in chose of substrate,stack-up,impedance design and layout stage, and optimal design can be completed by optimizing and adjusting in this stage. Problems are sloved by simulating actual routing in routing stage.The results of test indicate that the performance of XFP achieves all reqursts. This approach not only reduces development costs ,but also shorten development period.