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The Design Of 10Gbps Small Form Factor Pluggable Transceiver Module

Posted on:2006-06-09Degree:MasterType:Thesis
Country:ChinaCandidate:Z R ShiFull Text:PDF
GTID:2168360182955139Subject:Communication and Information System
Abstract/Summary:PDF Full Text Request
The spread of broadband access services requires the development of high-speed low-cost optical communication systems for local area networks (LANs), wide area networks (WANs), and storage area networks (SANs).In such background, lOGbps data link interfaces, such as the 10-Gigabit Ethernet, SONET OC-192/SDH STM-64, and Fiber Channel, have recently been standardized. The Multi-Source Agreements (MSAs) have led to the development of one transceiver after another, including the 300-pin MSA transponder, XENPAK, XPAK, X2, and XFP. At present, XFP is considered as the most prospect technology in the 10G modules. XFP is low-cost and the application field of XFP is widely for its independence with the protocol. It makes the high port density application come true with the characteristic of small form factor pluggable.After introducing the structure principle and the functions of each part of XFP in the paper, the author chose EM scheme by comparing the ways of modulation. In the part of key circuit, the author analyses the high-speed interface, including PECL LVDS and CML, and then manners of driving and coupling are compared in the part of laser interface. According to the characters of chips chosen, the author adopted the method of single-ended to drive a laser Diode with an AC-coupling capacitor. The APC and extinction ratio control circuit are also introduced later. At last, the author analysed the principle of Bias-T used for supplying bias current or voltage and the simulation design.The analysis of signal integrity runs through to the entire process of PCB design. The author tried his best to restrain the factors affecting the quality of signal in the process of the chose of substrate stack-up and impedance design. Simulation plays an important role in the design, which optimizes the circuit design of laser interface and confirms the location and value of decouple capacitors.After the design of XFP completed, the results of test indicate that the performance of XFP achieves all requests. And some parameters such as extinction ratio-, optical power, exceed that of overseas same products. These also promise that simulation design will play a more and more important role in high-speed design.
Keywords/Search Tags:XFP, MSA, Bias-T, impendence, S parameter, signal integrity
PDF Full Text Request
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