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High Speed Integrated Circuits Device Under Test Board Simulationand Design

Posted on:2011-11-22Degree:MasterType:Thesis
Country:ChinaCandidate:X Q WangFull Text:PDF
GTID:2178330332471409Subject:Electronics and Communications Engineering
Abstract/Summary:PDF Full Text Request
High speed integrated circuit DUT(Device Under Test) board which quality determinates the accuracy of the test result plays an important role in integrated circuit test system. With the increase of integrated circuit speed, signal integrity has become one of the problems must be concerned in high-speed DUT board design. The problem caused by some factors such as parameters of integrated circuit,layout of DUT board and high speed signal traces,etc ,can lead to the unstable state during the test of the high speed integrated circuit or make the device even cannot be tested at all. How to fully consider SI and take effective measures has been a key factor of a DUT board design.This paper introduces the problems of signal integrity in high speed DUT board design. According to the theory of the signal integrity, discusses the correlative problems of transmission line and simulates the corresponding waveform by virtue of Polar Instruments corp. EDA software CIT-25 and Mentor Graphics corp. EDA software HyperLynx. On the base of the discussion above,I finished one kind of high speed integrated circuit test board design.Demonstrated by the result analysis of this high speed integrated circuit parameter test ,this DUT board has steady performance and reliable accurate test result, having achieved the success of making high speed test board for the first time.On the base of the signal integrity analysis above,using powerful EDA tools,we can design the required high speed DUT board ,shorten the research period,save the cost and improve the performance at the same time.
Keywords/Search Tags:Integrated, Circuit, Device Under Test Board, Signal Integrity
PDF Full Text Request
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