Simulation Research On The Effect Of Signal Integrity Of Printed Circuit Board Transmission Line Manufacturing Pocess

The development of electronic product′s high speed, miniaturization and intelligencehas enhanced system basic frequency with decrease of the chip feature size. Signalintegrity becomes the key of realization of high speed system, as well as the focus in thefield of high speed research. The physical interconnection of system signal integrityincludes four levels which are chip, chip packaging, printed circuit board and systematicconnection. Printed circuit board is the foundation of electronic interconnection; it alsointegrates the entire interconnection component to form a specific functional modules orproducts. The electrical properties of printed circuit board transmission line directlyaffect the signal integrity in high speed system.In view of the above questions and PCB manufacturing process in transmissionline as the main research object, this paper carries on a detailed discussion and researchabout how the PCB transmission line production process affects the signal integrity ofhigh speed system by using the circuit simulation technology. The main contents are:1. A thorough discussion to the physical basis of transmission line and signalintegrity. Put forward for an analytical method of the design transmission line and theactual transmission line, combine PCB with signal integrity by transmission line theory,and provide a theoretical basis for signal integrity.2. Theoretical analysis to the destruction of PCB transmission line. Apply the testmethod of system terminal signal integrity to the characteristic research of PCBtransmission line, provide criterion for the research of signal integrity with eye diagramand S parameters considering as signal integrity′s characteristic parameter of passivetransmission line in time domain and frequency domain.3. Carry on a comprehensive analysis to the simulation technology of signalintegrity, apply the Polar Si9000simulation technology to PCB manufacturing, putforward the control standard of PCB transmission line precision changes with frequency,through the simulation of geometric structure such as wire width, wire spacing, fillingmedium, interlayer conducting hole, conductor surface roughness, welding plate and reverse welding plate, to ensure the consistency in characteristics between the actualand designed transmission line.4. Proceeding a simulation research to the manufacturing process of PCBtransmission line, from the point of view of signal integrity, this paper will analysissome crucial processes’ influence to geometric structure, such as multilayer lamination,conducting hole production and surface treatment; put forward the optimization of PCBtransmission line production process; improve and prevent PCB actual transmissionline’s effects to signal integrity.