Study On Signal Integrity And Power Integrity Issues For High-speed Printed Circuit Board

Signal integrity issues become increasingly more and more serious, With the rapiddevelopment of high-integrated chip technology and high-speed circuit. Theseproblems have brought great challenges to the design of system hardware. Meanwhile,it is the trend of the electronic systems toward lower supply voltages, larger transientcurrents, higher speed, higher integration and higher power consumption. The analysisand design of power integrity are critical to the success or failure of new products. Inthis paper, issues concerning SI and PI in high-speed circuit design are studied andactually simulated.Firstly, the mechanism of the signal reflecfion and crosstalk is elaborated in thispaper. Secondly, the simulation and analysis are detailedly presented of the signalreflection and termination method, through the use of ADS. Meanwhile, we alsoconduct the analysis for factors which may affect the crosstalk, by using the simulationtool HyperLynx. Additionally, some effective measures are summarized to reduce oreliminate crosstalk basing on the analysis. Finally, a deep simulation and design isdone in the key network, combined with the actual high-speed circuit, for instance,reflection, crosstalk and so on, with the Specctraquest of Cadence software.Power distribution network(PDN) and the target impedance are expounded inpower integrity. Furthermore, two design methods based on the target impedance andpower delivery are elaborated in order to designing lower impedance PDN. And then,lower impedance PDN is designed with design methods based on the target impedanceand power delivery.Through the above simulation and analysis, design rules and methods areproposed to solve signal integrity issues and power integrity issues of the high-speedcircuit,which are useful to design the high-speed circuit in practice.