Thermal Modeling Of TSV And Microchannel In 3D Packaged System

To meet the demands of higher performance,lower power consumption,smaller size and lower cost,3D integration technology is very attractive to overcome the obstacles of interconnection expansion,and is considered to be the most potential development direction of next generation integrated circuits.However,due to the large increase in transistor density and the reduction in effective heat dissipation area,the temperature of the chip increases.Therefore,effective thermal management becomes one of the most critical issues in the 3D integrated circuits(ICs)solution.Vertical integration of integrated circuit models using through-silicon via(TSV)technology is considered one of the most viable solutions for developing next-generation electronics.TSV technology is a key component for implementing 3D integrated circuits by inserting TSVs into the upper and lower layers to conduct heat along the device layer to the heat sink.However,accurate modeling of system level package structures with a large number of TSVs is very complicated.For example,it consists of an inner cylindrical metal conductor and an extremely thin layer of oxide(micronscale)wrapped around it,causing multi-scale problems,making the mesh of the 3D IC structure very dense,which seriously affects the efficiency of the solution.In addition,the integration of the microchannel heat sink between the ICs layer and using the liquid cooling circulation system to take away the high heat flow generated by the device,can significantly improve the heat dissipation effect of the system.The robustness and subsequent thermal management of 3D ICs depend to a large extent on the accurate modeling and analysis of the system at the beginning of the design.Therefore,it is necessary to study the effect of liquid cooling on IC thermal behavior to optimize the performance,cost and reliability of 3D IC.In this paper,two effective TSV structural equivalent thermal modeling methods are proposed to obtain the equivalent thermal conductivity calculation formula.Then the equivalent thermal parameters are extracted for the micro bumps structure.Finally,based on the compact transient thermal model method of 2R and 4R structures,the 3D-ICE simulator and MATLAB were used to thermally and thermally analyze the microchannel liquid cooling model in a typical 3D IC.