Research On Thermal Key Technology Of High-performance Microprocessor Based On Three Dimensional SiP

After 40 years’ development, integrated circuit technology has entered the deep sub-micron and ultra deep submicron stage, bringing a lot of difficulties and challenges to the development of high-performance microprocessor. The power, the memory latency and bandwidth, and the on-chip interconnect problems of two-dimensional integration technology, hindering further improvement the performance of high-performance microprocessors. SiP is a new three-dimensional integrated circuit packaging technology. By stacking multiple chips in the vertical direction, 3D SiP can improve the chip integration density, effectively reduce the interconnect length, providing advantages for designing high-performance, highly integrated IC and multicore / many-core microprocessors, which is an important development trend of future integrated circuits.Vertically stacking of multiple dies greatly increases the power density and reduce the cooling surface area. Because the middle die can not connect to the heat sink, the severe temperature problem get worse in 3D SiP, which greatly influences its performance and reliability. So it is of great importance to manage temperature in High-Performance microprocessors based on 3D SiP. The design and temperature management of High-Performance microprocesor based on 3D SiP greately relies on the effects of the heat analysis and the accuracy of simulation of the heat distribution and changing pattern. Therefore, it is necessary to research and establish an accurate and efficient thermal model.The cooling demand introduced by the over high temperature of the microprocessor based on 3D SiP is no longer satisfied by the traditional air cooling. By establish the micro-channels between chips, micro-channels liquid cooling technology can dispate power more effectively and lower the chip temperature. It is a effective cooling technology. 3D-ICE is a prevailing 3D IC transient temperature simulator for micro-channel liquid cooling. By simulating the microprocessor based on 3D SiP using the the 3D-ICE, it is discovered that the temperature of different layers is greate. As a important component of the 3D SiP, TSV is made by high thermal conductivity metal, which promotes the heat exchanges in different layers. Therefore, it is essential to take into account the TSV’s impact on the heat exchange. This thesis analyzed the structure of TSV and modeled its heat charateristic of square and round TSV in the case of different locations, structures. The 3D-ICE simulator is also modified to support simulating the TSV structure, and its accuracy is verified in this thesis. Using 3D-ICE, the influence of different layout, number and size to the 3D IC is analyzed. Finally, the this thesis analyzed the heat cooling properties of 3D SiP. Based on the conclusion, this thesis proposed the temperature tuning method for the 3D IC suitable for micro-channels liquid cooling from the static and dynamic aspects.