Development And Industrialization Of FC Package Technology

System-level packaging is one of the hot spot sealing and testing technologies recently developed in the field of integrated circuits.System-level packaging technology uses MCM technology to effectively assemble analog circuits,digital circuits,memory,power devices,optoelectronic devices,microwave devices,and various chip components into the package.A multifunctional component,subsystem,or system that can not be completed by a single half conductor integrated circuit.It can reduce the crosstalk noise between the lines,and the impedance can be effectively controlled,so that the overall performance of the integrated circuit can be improved.In the future,integrated circuit technology,whether it is its feature size,chip area and the number of transistors contained in the chip,or its development trajectory and IC packaging,the mainstream of development is that the chip is getting larger and larger,and the area is rapidly decreasing;The packaging volume is smaller and smaller,and the function is stronger and stronger.Thickness becomes thinner,the spacing of leads continues to shrink,and the number of leads is also increasing,and the pins are drawn from both sides to the surrounding pins,and then the pins are inserted in the end;The cost of packaging is getting lower and lower,the performance and reliability of packaging are getting higher and higher,the density of IC in unit packaging volume and area is getting higher and higher,and the line width is getting finer and thinner,and it is developing from single-chip packaging to multi-chip packaging.In recent years,the fixed method for chips of flip chip appear as one of the most successful packaging technology.Flip chip used in rf system,it can minimize the parasitic benefits fundamentally.Flip chip due to the use of the ball array to make electrical contact,to minimize the stray inductance and provide the most suitable method integration of video signal transmission to the next level.Through the research and development of key packaging technologies and key processes,this paper will complete the breakthrough of various process technologies integrated packaging at multiple chip system level,form an advanced package of process technologies,and obtain independent intellectual property rights.At the same time,research and development are carried out on the packaging design,key process technology,reliability,etc.required for industrialization,and on this basis,product positioning,process technology research,small trials,medium trials,andindustrialization are carried out;The multi-chip RF system-level packaging technology has reached the leading level in China and is in line with the international level,so as to achieve miniaturization and ultra-thin type of packaging.