Research On The System Of 300 Dual Spindle Dicing Saw

Now in the information age,the electronics industry is developing rapidly,and it is moving towards lightweight,miniaturization,strong performance and rich functions.Meanwhile,the size of the chip is getting smaller and smaller,also the internal complexity is getting closer and closer.At the same time,the number of input and output of the circuit is increasing,and the packaging integration of the IC circuit is increasing.High-precision packaging technology also accompanies the growth.As a key process for integrated circuit packaging after the cutting machine,the cutting processing capacity of the cutting machine determines the chip yield and production capacity to a certain extent.The wafer size has gradually increased,and the equipment suitable for its processing must also be automated.The processing efficiency of single-axis equipment has not reached the development of the industry,and the dual-axis processing mode has increased the efficiency by 80%.At the same time,for the material processing of multilayer substrates,different materials are processed using different grinding materials,and different blades need to be loaded on two axes to asynchronously process different materials.With the birth of the 300mm biaxial cutting machine,the trend of semiconductor materials on the market will gradually expand from 200mm to 300mm.At the same time,the complexity of the material can be doubled,and the possibility and complexity of the etched circuit can also increase more possibilities.Sex.The core technology and key technical points of 300mm precision automatic wafer cutting have long been monopolized by a few companies in advanced semiconductor technology countries such as Japan and Switzerland,and most of the domestic semiconductor front-end processing companies rely on imports to research 300mm cutting machines with independent intellectual property rights.It has great significance to developing our Chinese semiconductor industry.The following of the paper are the main research work and results.(1)The principle plan design and detailed structural design analysis of the dual-axis cutting machine are carried out.The hardware structure of the whole machine is designed.The equipment has a cutting stroke of 300 mm,dual-axis simultaneous cutting,and a layered cutting process.The key bridge-type structure is mainly applied with SolidWorks software,and the static analysis based on the finite element theory is performed to obtain the stress,strain and natural frequency of the bridge-type structure under the external load.The corresponding technical indicators are improved accordingly.(2)The control system of the dicing saw is designed.A systematic analysis is focused on the accuracy control.Using the theory of linear interpolation,laser sampling compensation is performed for the Y-direction accuracy,so that the accuracy of the dual-axis in the 300mm cutting range is within 5 microns.(3)The machine vision system is used to achieve precise alignment of the cutting machine and knife mark detection.Aiming at the tasks of precise alignment and accurate knife mark detection in the work of the cutting machine,the overall design of the cutting machine vision system was designed.According to the characteristics of the kerf,the image processing algorithm and kerf check detection of the automatic alignment system of the dicing saw were respectively.The system has carried out in-depth research and study,proposed an improved gray histogram detection method,and used OpenCV to verify the alignment and detection algorithms on the machine,and achieved good results.The sequential similarity image matching algorithm based on the actual application is adopted and improved,which greatly improves the speed of the template matching operation.First,the positioning marks are obtained quickly and quickly,and then the high-power lens accurately determines the position,and the rotating motor is controlled to adjust the chip.The angle of theta axis achieves high-precision alignment of the chip,and the feasibility and reliability of the algorithm are verified in actual production on the device.(4)Aiming at the defects of QFN materials that are prone to delamination and burr melting during cutting,which directly affects the film formation rate and quality,the biaxial cutting equipment is used to verify the improvement of the biaxial cutting process and the efficiency of biaxial cutting.At the same time,a layered scribe method is proposed to deal with defects such as cracks,chipping,back chipping,and chipping that are easy to occur during wafer cutting.The single crystal silicon material is cut by a biaxial cutter.One shaft is easy to collapse on the chip surface using a blade suitable for reducing the collapse,and the other shaft is cut through using a blade suitable for reducing the collapse.I studied the effects of dicing parameters such as blade type,cutting speed,spindle revolution,and cutting depth on the dicing effect.The analysis and comparison of ANOVA method were used to find out the process parameters of silicon material layered dicing.The dicing comparison test shows that,compared with the single blade dicing method,the dual spindle dicing process can better control chip chipping and back chipping,and improve the dicing quality.