Research On Fault Tolerance Technology Based On Hexagonal Silicon Through Hole

One of the important technologies for the continuation of Moore's law is the three dimensional chip technology based on Through Silicone Via(TSV).Three dimensional integrated circuits(3D IC)utilize the vertical interconnect of TSV layers of chips.Compared with the traditional Two dimensional integrated circuits(2D IC),Three dimensional integrated circuits have the advantages of short delay,high integration degree,high bandwidth,less power consumption and low noise.However,TSV failure occurs during the manufacturing process or stack binding process.The yield of 3D chips is mainly affected by the yield of TSV.Once TSV has a single failure or cluster failure but cannot be repaired in time,the yield of 3D chips will be greatly reduced.Therefore,it is very important to add the appropriate amount of redundant TSV in the appropriate position of the three-dimensional circuits.When TSV fails,proper placement of redundant TSV at the appropriate location for fault-tolerant repair can not only improve the reliability of the chips,ensure the yield of the entire 3D chips,but also reduce the delay and save the hardware cost.Based on the above situation,this dissertation has prepared the following work:1)studied the research background of 3D IC,the development and inevitability of 3D IC are learned,and researched the challenges of 3D IC.2)learned about 3D integrated circuits and TSV.3D integrated circuits related technologies,including 3D integration,3D stack,3D alignment and 3D chips thinning technology;Analysis of TSV manufacturing process,electrical model,TSV defect causes and fault types.The influence of TSV on chips yield was also researched.3)researched the existing TSV fault tolerance technology,analyzed the advantages and disadvantages of different fault-tolerant structures,and studied the practical application of 3D chips technology.4)proposed diagonal hexagonal TSV redundancy structure design.Take advantage of the unique structure of the hexagon,and rationally configure the number and position of redundant TSVs.The experimental results show that,compared with the existing fault-tolerant structure,the diagonal hexagonal TSV redundant structure has high repair power,and has improvements in area cost,repair path length and delay.