The Research On The SiP Test Technology Based On JTAG Test Technology

System in package is a high density integration technology produced by the development of integrated circuit.The obvious advantages on microminiaturization,weight reduction,high density,and high reliability has attracted extensive attention.The research on SiP test technology has been a hot issue all over the word.The systematic SiP test methodology based on JTAG test technology has been proposed in this paper,combining the MCM test technology and the Board JTAG test technology.A SiP module researched and produced independently by 772 has been chosen to implement the test method.The main research work in this paper is as follows:The 1^st chapter introduces the research statues of SiP and the application of the JTAG test technology.The 2^nd chapter focus on the Board JTAG test technology,the electronics test technology and the DFT technology.The 3^rd chapter presents the systematic SiP test methodology based on JTAG test technology,which contains five aspects:the design requirement of SiP?about test?,the test demand of SiP,the test flow of SiP,the hardware and software demand of test platform and the final test platform design.Among the five aspects,the first four can be researched without the specific SiP design,has been researched in chapter 3.The 4^th chapter focuses on the test implementation.A SiP module BM3109IB,researched and designed by 772,has been chosen to be the test object.The specialized test hardware platform has been designed and produced.A software platform has been chosen to assist the SiP module test,which has been widely acceptable in the Board test.The 5^th chapter is the test results and analysis of.The interconnection test coverage is above 98%,and the chip functional test of SRAM has been implementated.Furthermore,the test plan of BM3109IB module has been established to accomplish the systematic test scheme.This paper can conclude that the systematic SiP test methodology can raise the testing transparency sharply with high test coverage and solve the problem on the confirming,isolation and location of system malfunction.Furthermore,the methodology has shown the powerful inclusiveness and independence by containing various die functional test,and possess strong engineering quality and widespread applicability for establishing the production test and personalized test of SiP module.