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Design And Implementation Of Flash Controller IC CR2511 Burn-In Test System

Posted on:2018-09-04Degree:MasterType:Thesis
Country:ChinaCandidate:Y W HanFull Text:PDF
GTID:2348330542462878Subject:Computer technology
Abstract/Summary:PDF Full Text Request
In recent years,along with the country attaches great importance to the integrated circuit industry,given special funds to support,through the shackles of the R&D,design,production,packaging and testing all aspects of,the integrated circuit industry ushered in the new spring.Compared with foreign well-known suppliers,Chinese IC companies to grow steadily,and constantly grow,in the design of the superior performance of the chip at the same time,but also to the good quality.The cause of this phenomenon,on the one hand is because Chinese IC design companies started late,less accumulation,chip performance relative to the old foreign chip company will rival.Another reason is that the chip and the use of stability in the process of the lack of security,such as the use of life in different stages,the failure ratio of lack,some even has not been assessed their products use cycle and other parameters.International application in different areas of the life of the integrated circuit products are different requirements,from consumer electronics to industrial electronics and then to the automotive electronics,the use of the chip to be extended.The goal is for flash memory control chip CR2511 design a can assess the chip's service life,aging fail proportion of aging test system,the most important is the cost of the system is low,can most start-up enterprises being copied.First,according to the calculation formula of aging test,the relationship between test samples,test temperature,applied voltage and test cycle is calculated.Secondly,the need to analyze the design of CR2511 SOC architecture,the full use of MCU SOC to conduct more operations to reduce the external hardware needs,thereby reducing costs.Then write the firmware,the control chip enable as many module work,the aging process as close as possible to the actual situation,at the same time,through the chip GPIO pins,signal output,making the outside to the output signal recognition chip state to judge is in the normal aging process,or running or other fly.Finally,test specific implementation steps,custom check interval,test records,chip of the failure time,record the amount of for computing chips use cycle,early defective rate,fit parameters.
Keywords/Search Tags:Burn-in, SOC, Firmware
PDF Full Text Request
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