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Experimental Study And Numerical Simulation Of Thermal Layout Optimization Of Electronic Components On PCB Board Based On Intelligent Algorithm

Posted on:2018-04-24Degree:MasterType:Thesis
Country:ChinaCandidate:Y WangFull Text:PDF
GTID:2348330536984889Subject:Master of Engineering Power Engineering
Abstract/Summary:PDF Full Text Request
With the rapid development of electric vehicles and power electronic equipment technology,components of electronic equipment is in the development of small size,high power,high integrated,so the heat flux electronic components gradually increased,when the heat flux exceeds a certain limit will make the work of electronic components too high and cause fever failure problem.Printed circuit board(PCB)PCB and electronic components are widely used in electronic equipment,its thermal design and thermal analysis have important significance to improve the performance of automotive electrical equipment.In this paper,the simulated annealing algorithm is used to optimize the temperature distribution of some electronic components on a PCB board.Based on the 9 electronic components arrays on the PCB,the finite difference method is used to solve the temperature general equation of the electronic components on the PCB.In this paper,the experimental results are verified by infrared imaging technology.The experimental results show that all the highest temperature of the global electronic components are different degrees decline under different working conditions,the highest decline was 8.7%,the lowest decline was 6.5%,this proved that the method of using simulated annealing algorithm to optimize electronic thermal layout PCB has obvious effect.Finally,the simulation research is carried out by using the three-dimensional simulation software Icepak.Firstly,comparative study before and after optimization of the experimental results and the simulation results various conditions,and then study the simulation results before and after each condition optimization,results show that: 1)under various conditions,the relative deviation of the same electronic component temperature of experimental value and simulation value is less than 10%,the simulation model is reasonable;2)the global electronic highest temperature components are obviously decreased in different degree in all conditions of simulation,prove that optimization method has effect;3)numerical simulation can replace the experiment and play a great potential in engineering application.
Keywords/Search Tags:Thermal design, electronic components, intelligent algorithm, thermal layout optimization, numerical simulation
PDF Full Text Request
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