The Study On The Influence Of Copper-cladding Patterns On The Thermal Layout Optimization Effect Of Electronic Components On PCB

Due to the rapid development of electronic technology,electronic components are increasingly dense on PCB boards,and the chips tend to be smaller in size,and the operating power is also higher.This has caused a series of technical problems,the thermal load during the operation of the electronic device is an important factor that affects the stability of its operation.Intelligent Optimization Algorithm Thermal layout optimization is one of the methods to reduce the thermal load of electronic components.This method is not only cost-effective but also effective.This paper analyzes the influence of different copper-cladding patterns on the thermal layout optimization effect of electronic components on PCB by using intelligent optimization algorithms,which is closer to the structural features of real PCB boards,and verify the actual effect of the intelligent optimization algorithm.In this paper,infrared thermal imaging technology was used to conduct experimental research.During the experiment,the thickness of the copper layer of the PCB,the distance between the components,the area of the copper clad were changed.By measuring he surface temperatures of electronic components under different copper cladding patterns,the effect of different copper patterns on the influence of the thermal layout optimization effect was obtained.The experimental results show that the global maximum temperature of the optimized layout of electronic components under different copper cladding patterns has been reduced to varying degrees.The results show that the smaller the thickness of the copper layer,the closer the distance between the components,the larger the area of copper clad,thermal layout optimization is more obvious.In this paper,the three-dimensional simulation software Icepak was used to simulate the study,and the experimental results under different copper-cladding patterns were compared with the simulation results.The results show that the influence of the copper-cladding pattern on the thermal layout effect of the electronic components on the PCB is consistent with the experiment,and the difference between the experimental value and the simulated value of the temperature of the same copper-cladding electronic component is less than 10%,indicating that the simulation model has high accuracy.In addition the Thermal Structural software hasused for thermal stress simulation studies.The results show that the maximum thermal stress and the maximum thermal deformation of the electronic components optimized under different copper cladding patterns have been reduced to varying degrees.The greater the distance between components,the smaller the thickness and the larger the area of the copper layer,the the decline of the maximum thermal stress and the maximum total deformation of the PCB board is more pronounce.