Thermal Design And Structure Optimization Of Hign-density Sealed Electronic Equipment

Through design practice of high-density sealed electronic equipment, the design ideas and several specific cooling methods in structure thermal design were described.In this paper, the engineering actual application for the thermal design and optimization of high-density sealed electronic equipment of based on the numerical heat transfer, the computational fluid dynamics and the finite volume method has been discussed. The establishing, dispersing, linearization of integral control equation of based on the finite volume method were analyzed. The equipment of the structure and boundary conditions were discussed and the heat source analysis and the net heat transfer model were established. Complex method based on genetic algorithm and numerical simulation were separately used to the establishing of an optimization object function and the structure optimization of flat fin heat sink of the sealed cabinet. Making use of the numerical heat transfer and computational fluid dynamics calculated the size of heat-conducting plate.Combined the above improvement optimization project, thermal simulations of the sealed cabinet make use of Flotherm which is professional thermal analysis software and confirmed the best improvement optimization project. The tests of actual equipment make use of the method of the test of thermal resistance. The result of thermal analysis and experiment data are compared, the error was analyzed. The best cooling method was proved correctly.