Optimize The Layout Method Of Electronic Components Based On The Thermal Reliability Of The Pcb

The modern electronic product becomes lighter, thinner ,shorter and smaller. The increasing consumption of power has led to the significant increase in power densities of modern electronic equipment. So overheating problem is paid more and more attention. If do not pay attention to the thermal management of electronic equipment during the design period, the large amount of heat generated by the electronic device would not be under the control, therefore the product's reliability may be affected and lead to deteriorate the system stabilization or even make the whole system disabled. While installing the chips on the Printed Circuit Board(PCB), the heat distribution's problem is especially important. The aim of this thesis is the place optimization of the PCB, based on the thermal fail-safe analysis. The research object is a chip-array that fixed on one of PCB, which are located in a natural air field(natural convection)in an electronic case; and use the mathematical mode of the natural flow; then we can establish the finite element algorithm and apply software (ANSYS) to display and analyze the field of temperature. After the simulation, we can get the working temperature of individual chip.In order to make the temperature field of PCB rationalizing, with the Matlab program realize the annealing algorithm to the optimization of place distribution design. Under the unvaried condition of thermal dispersion, we can get the least temperature of the maximum value in some kind of chip array.Through applying the ANSYS software, this paper analyze temperature the field of the PCB; we realize the annealing algorithm's optimizing technique and solve the problem of chip-array on PCB, and settles a base for the electronic equipment's thermal reliability design.