Research On Conditional Thermal Layout Optimization Of Electronic Components On PCB Board Based On Simulated Annealing Algorithm

With the rapid development of the electronics industry,the use of electronic devices in automobiles has become more widespread.The integration of electronic components on the PCB is getting higher and higher,the chip size is also becoming smaller,and the power is gradually increasing.As a result,the heat flux density of the entire PCB is sharply increased,and the surface temperature of the chip is too high,which causes a series of thermal failure problems.The use of intelligent optimization algorithms for layout optimization can effectively reduce the thermal load on the electronic components of the PCB.In the actual industry,the position of the chip often has some positional restrictions.In this paper,closer to industrial applications,the simulated annealing algorithm is used to optimize the thermal layout of electronic components on the PCB,and the influence of the maximum power chip on different positions is analyzed.In this paper,the simulated annealing algorithm is used to optimize the thermal layout of the PCB with nine chips.The finite difference method is used to solve the general relationship of the temperature field of the PCB.The simulated annealing algorithm is programmed by Matlab software to carry out the electronic components of the PCB.The conditional thermal layout is optimized to obtain an optimized layout of three different fixed conditions for the same set of different power chips.In this paper,infrared imaging technology is used to conduct experimental research on the optimized layout and a set of random layouts.The experimental results show that the maximum surface temperature of the three optimized layout chips is lower than that of the random layout,which indicates that the simulated annealing algorithm is effective for optimizing the thermal layout of electronic components on the PCB.Among them,the maximum power chip is fixed close to the corner position,the optimization effect is the most obvious,the maximum drop is 8.81%;the maximum power chip is fixed at the boundary center position,the optimization effect is general,the maximum power chip temperature drop is about 4%;the maximum power chip is fixed.The optimization at the center is the worst,with a maximum drop of 1%.Finally,the professional thermal simulation software Icepak is used to simulate theexperimental content of this paper.The simulation results are compared with the experimental results.The simulation results are consistent with the experimental results.In the specific numerical values,the deviation between the simulated values and the experimental results is within 10%,which proves that the simulation modeling and calculation parameters are set properly.It also proves the effectiveness of the conditional thermal layout optimization.The simulation can replace the experiment to quickly obtain the PCB temperature field.Then the simulation method is used to simulate and analyze the two condition-limited working conditions.The previous conditions were almost the same,which again proved the effectiveness of the simulated annealing algorithm for the thermal layout optimization of the PCB.