The Research On Microchannel Heatsink For High Power Semiconductor Laser's Dissipation

The problem of dissipate heat is an important factor which confines the development of the high power semiconductoe laser. In order to increase the output power, reliability and stabilization, microchannel heatsink which is one of active heatsinks is used to cool high power semiconductor diode laser arrays in the paper.The heatsink can achieve lower thermal resistance and fine temperate homogeneity. According to heat transfer and hydrodynamics, the thermal flow dynamics and the thermal resistance microchannel heatsink are analyzed. Based on the analysis, the heat sink materials, cooling liquid, the heatsinks structure,and the bonding of laser bat are optimized in order to increase the transfer efficiency.Considering the practical manufacturing condition,an Oxygen-free copper microchannel heatsink consisting of five copper sheets is designed and fabricated utilizing the technology of photolithography, mechanical maching, and bonding with medium .By testing ,the thermal resisitance of the maded heatsink is 0.648℃ /W ,which is consistent with the result of theoty counting.