Signal And Power Integrity Analysis And Application In High-speed PCB Design

With the rapid development of integrated circuit technology, signal integrity(SI)and power integrity(PI) issues have caused a great impact on the stability of circuit systems and they have became increasingly evident in high-speed circuits. For electronics engineers, it has been an important part to handle the SI and PI issues correctly in high-speed circuit design and debugging process.The high-frequency characteristics of passive components and transmission lines have been analyzed in this thesis, as well as the causes and optimization methods of reflection, crosstalk, timing and power integrity issues of high-speed interconnection.The effect of reflection, crosstalk and power problems that may exist in complex high-speed circuits is illustrated by a example of a PCB board based on i.MX6 Q processor in this thesis, and then we use IBIS models and Hyper Lynx to simulate,analyze and optimize the SI/PI problems in board-level design.A complete design and simulation process and rules of layout, routing and decoupling based on the simulation results have been established in this thesis in order to decrease the crosstalk, reflections, timing and power problems so they can be acceptable, and then complete the PCB design finally. This circuit uses eight layers of PCB design, optimize the high-speed interconnect to reduce the noise amplitude peak to 20 mV, and reduce the reflected noise by ODT. Control the lengths of command lines, control lines and data lines to meet the timing requirements and reduce power supply noise by optimizing the impedance curve of power delivery network.The simulation data, optimization methods and conclusions obtained in this thesis can provide a reference for high-speed digital circuit design.