An X-band T/R Module De Based On SiP Technology

The phased array radar has many advantages in practical applications and it is an important direction of modern radar studies. Many countries are seeking to develop phased array radar technology. T/R modules are the core of the active phased array radar. Since there are a large number of T / R modules in each phased array radar system, the performance of T / R modules directly affects the performance of the phased array radar. Studying on T / R modules with high reliability, extreme miniaturization and low cost will certainly promote the development of phased array radar technology. In recent years, the SiP technology develops rapidly,because it can combine a plurality of active electronic devices, a variety of passive components, MEMS and optoelectronic devices with different functions to form Single standard packages with different functions and form a system or subsystem using sophisticated packaging technology. SiP technology has lots of advantages, such as flexible design, short cycle, low-cost. Therefore, developing Low Cost T / R module technology research Based on SiP technology can fit the development direction of the active phased array radar.According to the required technical specifications of the project, we choose the required chips based on the overall design. The Gain, Noise Figure and other technical specifications of the receiving and transmitting branches have been evaluated under the conditions of the selected chips. ADS simulations verified the feasibility of the design scheme. In this project, the multi-layer circuit board is composed of two different dielectric substrate materials and a prepreg. The effect of changes in the dielectric constant on the corner structure has been verified by HFSS simulation. Additionally, HFSS simulations have also been done to validate what the thickness variations of the substrate and prepreg have impact on the transmission of the corner structure. Owing to the use of multilayer dielectric substrate, chips must be embedded in the molybdenum-copper alloy Molybdenum copper alloy which can play a good cooling effect. Fabrication errors of molybdenum copper alloy may affect transmission performance, which has been validated by simulations. We design circuit layout and cavity according to T/R module circuit implementation and the selected chips. We designed two editions of the T/R module and introduced the design processes of the two versions. The assembly process of T/R module and the testing steps before final testing have been introduced in details in this thesis. Finally, we have completed the test job of T/R module and found solutions to the problem during the test.