An X-band T/R Module Design Based On SiP Technology

Active phased array radar is the main trend of the current military radar systems ’research with considerable advantages: such as forming a plurality of independent beams with flexible and fast Beam pointing, achieving search, identification, tracking, guidance, passive detection and other functions simultaneously. It can monitor and track multiple targets with superior capability of Multi-target engagement and anti-jamming. In addition, phased array radar has high reliability, even a small amount of module is failed, it can still work. The key module which constitutes the active phased array radar is T /R module, its’ performance directly affects the work of the entire radar system. Research the miniaturization of T/R modules has far-reaching significance for the development of radar technology, researching on airborne, shipboard and other mobile weapons platform made a variety of needs of T/R module’s Miniaturization, high performance and high reliability. Proposing and developing SiP(system in package) technology is fit for the trends of T/R module’s research. As a new and rapidly developing packaging technology, SiP technology will promote the development of the T / R module with its own unique advantages.Firstly, the X-band T/R module based on SiP technology of this paper introduces the background of T/R module,describes the development of SiP technology, and makes a rough introduction of domestic and foreign-based SiP technology T/R module’s research and development. And then, simply introducing the concept of collaborative design and circuitry associated, according to the study of this paper, proposing the system-level co-design scheme of T/R module based on SiP technology. This co-design scheme builds a systematic framework for the entire T/R module R & D, and in many aspects of the overall design, transceiver branches design, multilayer substrate transport, interconnection and the key technologies’ feasibility detail the implementation of system-level co-design process. According to the theoretical analysis as well as understanding on the domestic multilayer process, this paper proposes a new Multilayer Composite Medium Substrates technology and describes the advantages of it. Then this paper study the thermal properties of T/R module from the cooling solution of chips to the entire T/R module system thermal environment, ensuring a good thermal environment of T/R modules’ working radically. Under the premise of communicating with the manufacturers on processing and other aspects and basing on the results of the different modules and key technologies, this paper makes circuit design, processing and testing for T/R module. For the problems of each test,making effective feedback to the design level and continuous optimization, improving the design so that it can meet the appropriate indicators. Finally, this paper makes completion of the X-band T/R module design based on SiP technology.