Design Of Virtual Manufacturing Teaching System For Integrated Circuit Package

As the world’s first largest manufacturing country of electronic information products, China is in the era of rapid development of the electronic industry. Many famous companies of electronic technology in the world put a large number of one level and two level package into our country, which promote the development of China’s packaging technology. At present, more and more attention has been paid to the development and research of IC packaging materials and packaging technology. Many schools have also opened a professional course or subject direction. Although the industry urgently needs talent, many colleges and universities especially colleges have teaching difficulties in training such students. This is due to the various techniques used in the packaging process, as well as the complex technology and equipment. And it is difficult for students to access to the expensive production line, which leads to the lack of intuitive knowledge gained from books. In this paper, aiming at this teaching problems, the teaching software is designed based on the virtual manufacturing technology and it is used to assist the teaching of integrated circuit package. This is the first attempt of research in the field of IC packaging, which using virtual manufacturing technology.The main research of this paper are carried out from three aspects, which include the research on teaching content of IC encapsulation, the research on Application of virtual reality technology, and the research on software design and implementation. First, in reference to a large number of relevant literature and books of integrated circuit package, through systematic refinement and induction, the teaching system software is divided into four parts:IC package type, IC encapsulation method, IC packaging technology and IC packaging equipment. And it puts forward the expert rule based of integrated circuit packaging technology. Second, it used the virtual reality technology to exploit the integrated circuit package manufacturing teaching system, and it used the form of interactive 3D animation and expert rule base for teaching and evaluation, which makes students understand the knowledge of integrated circuit package clearly. Expert rule base includes: selection of process method, equipment parameter optimization setting and equipment operation method and procedure. Third, in the aspect of program, it finished the design of integrated circuit packaging virtual manufacturing teaching system software, including the IC packaging method, IC packaging technology, IC packaging equipment and evaluation system. IC packaging equipment including:film machine; cutting machine (laser, machinery); install (bonding machine, dispensing device) chip; chip welding (gold wire ball welding machine, Ultrasonic Wedge welder, load with a key machine, flip chip bonding machine, paste welding machine); sealing machine; lead plating line; tendon cut forming machine; test sorting machine. In order to complete the work more efficient and convenient, in the aspects of database connection and video playing and applications of controls, it designed the corresponding class to encapsulate the corresponding functions. In addition, it optimized the button control of interface.In this paper, we use SQL Server, MFC and 3dsMax as development tools to complete the production of the above animation and the design of software. Using the friendly interface established by this software to assist teaching and introduce the IC package can improve the teaching effect, which makes the corresponding professional students in colleges able to understand the process of the production without going to the production site. Now, the software designed in this project, which based on the combination of other software modules, has been used in several colleges like Hangzhou Dianzi University, North China University of Technology, Changzhou Vocational College of information technology, Nanjing Vocational College of information technology.