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The Coupling And Package Research Of Planar Lightwave Circuit Splitter

Posted on:2013-12-21Degree:MasterType:Thesis
Country:ChinaCandidate:Y L ZhuFull Text:PDF
GTID:2248330371997718Subject:Optical Engineering
Abstract/Summary:PDF Full Text Request
The optical fiber splitter is the most extensive and basic passive component in the field of optical communication. With the development of the FTTH, especially the convergence of three networks, the growth of the market demand is very quick. And the planar lightwave splitter has many advantages, such as small volume, high integration, and the suitable for mass production. They are applied widely in the backbone and access networks in communication.It has two key factors in the production of the PLC splitter. First, it is the low loss of alignment between the fiber array and waveguide chip. Second, the stable and reliable Package process is another factor. Now, many manufactures produce this product in domestic. And the production process is become more and more skilled. In the competition to win, the properties of the splitters should be improved.Firstly, the coupling theory of optical waveguide is introduced. The primary factors affecting the coupling between fiber array and waveguide chip are analyzed in theoretically.Secondly, the construction of the production process is made, including the purchase and building the coupling system device, maintenance work. Each part of the coupling system is introduced in briefly. On the premise of the products quality, a new process is made. The schemes of alignment are introduced. And a proper scheme is chosen.Then, the production process of PLC splitter is formulated. First, through many data, we make the production process and improve every step in efficiency and the property in order to make the maxima efficiency. Then the testing method of parameters such as insertion loss, return loss, polarization dependent loss is made. Third, the package process is researched. And we introduce several different packaging modes, including the glue selection. After high and low temperature cycle experiment, the parameter still can meet industry IL standard.Finally, the high temperature and humidity test is researched. In order to choose suitable glue to package, the paper does the test with three different UV adhesives. And it gives some suggestions. We can choose different UV adhesives according to the different of the environment of use, the productive cost and the customer requirement.
Keywords/Search Tags:Planar Lightwave Circuit, Coupling, Fiber Array, Optical Waveguide Chip, Package Process, Reliability
PDF Full Text Request
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