Research On Millimeter Wave Frequency Conversion ＆ Amplification Chip And Receiving Circuit Technology

Millimeter waves have unique advantages in the application of communication and radar systems,which are reflected in:first,the millimeter wave spectrum resources are sufficient,which can effectively alleviate the dilemma of the depletion of the global medium and low frequency spectrum resources;second,the continuous large bandwidth of millimeter waves can meet the target application scenarios.Requirements for capacity,performance,etc.Various application requirements have led to continuous in-depth research on millimeter waves,and the entire industry and academia have devoted a lot of energy to the application of millimeter waves.According to the trend of miniaturization and integration of wireless transmission equipment,millimeter-wave integrated circuits and their packaging circuits are the current research hotspots.The main content of this thesis is divided into the following three parts:1.Research on the Ka-band up-converter of silicon-based technology.In order to improve the IF bandwidth and linearity performance of the upconverter,a two-channel transconductance stage method is adopted,and its principle for improving the linearity and IF matching is explained.Transformer-based differential baluns are also studied to achieve broadband impedance matching.Based on the above theory,a CMOS process Ka-band upconverter with a center frequency of 38 GHz and 55 nm is designed.The IF bandwidth of the converter is 4 GHz,and the OP_{1d B} is 2.1 d Bm,and the chip area is only0.9×0.7 mm~2,the overall power consumption is only 17 m W.2.Research on Ka-band single-stage amplifier in gallium nitride（GaN）process.Using a 0.15μm GaN HEMT power transistor,a gain of 8 d B is obtained,the highest power added efficiency is 29%,the OP_{1d B} is 29 d Bm,and the chip area is 0.9×0.3 mm~2.3.The 94GHz transceiver chip is packaged into a receiving module by wire bonding.At the same time,two versions of the receiving circuit were developed,one fed by the waveguide to the RF signal,and the other received the RF signal by the slot antenna.At the same time,a brief theoretical analysis was carried out on the interconnection structure model of the bonding wire,the structure model was established by HFSS software,and the RF signal transition structure was analyzed and simulated in detail,and the structure size was optimized.transmission performance.The module that feeds the RF signal from the waveguide obtains a bandwidth of about 4 GHz;the module that receives the RF signal from the antenna is measured to have a receiving bandwidth of 2 GHz.