Design Of Interchip I/O Interface Based On MCP

As the semiconductor processing technology continues to narrow,gradually close to the physical limit,while the processor working frequency is highly increase.The difference between data transmission rate and the processor working frequency has become a bottleneck restricting the overall performance of the system.The introduction of the method of multi chip package to alleviate this problem.MCP allows the external components can be assembled into the chip,so that not only greatly reduce the length of the interconnection between the processor and the MEMORY to improve the performance,but also to make a number of small chips can be assembled into one package and thus greatly improve the yield of large chips.However,although the MCP technology has emerged,the existing I/O components are not suitable for the MCP,resulting in a multi chip package is not perfect to achieve the desired effect.OPIO provides a solution for inter chip communication in MCP.OPIO is designed by using the single ended signal,but still has a high transmission rate,so that the overall area cost of the IO unit is greatly reduced.At the same time,the OPIO removes the complex signal recovery unit,and uses the passive components to ensure the signal integrity,effectively reducing the power consumption of data transmission.As a special IO,OPIO can solve the problem of IO in high speed data transmission.In this paper,the problem of data transmission in MCP is studied,the main contributions of this dissertation are as follows:1?On package interconnect structureFor the packaging of MCP,this paper designs a 2X2 core chip assembly structure,the 16 nodes in accordance with ordinary Mesh display.This structure requirements 3 different type IO structural.Traditional IO unit,long wire BUFFER and a special on package IO unit.2?On package IO logic designBecause of the emergence of MCP technology,the existing IO logic is not suitable for the inter chip data transimision,that require to design a new IO logic.In this paper,we analyze the transmission characteristics of the inter chip interconnection of MCP,and point out the shortcomings of traditional IO,and design a new special IO.3?IO unit circuit designBase on related research,this paper design and implementation of IO module OPIO circuit base on 40 nm technology.And also implementation a tranditional IO circuit for the external communication.