Thesis/Dissertation Guide For Postgraduates Of XIDIAN UNIVERSITY

Grinding-wheel Chip-cutting Machine is a key equipment in IC production line. It is a special precision cutting equipment mainly is responsible for cutting silicon, gallium arsenide, and gallium phosphide wafer in a semiconductor integrated circuit into single integrated circuits or pipe cores. Currently, the chip-cutting machines used in domestic IC production line are basically through imports, which unavoidably brings high purchasing cost, inconvenient repairs, expensive spare parts and long delivery time, and therefore largely restricts the development of the microelectronics industry in China. In order to promote the development of the microelectronics industry and at the same time meet the equipment demands of the domestic semiconductor manufacturers, we independently design and develop the automatic cutting machine according to the advanced technology standard in the world. The major contents of this thesis are as follows.Firstly, the working principle and structure of the automatic grinding-wheel chip-cutting machine is introduced. Through comparing the multiple solutions of the key machine components, the final design of the machine is determined by considering several major factors including the advanced nature, economical efficiency, feasibility, and peoriodicity. At the same time, the design of the key components along the main axes and the corresponding selection criteria are introduced.Secondly, based on the theoretical calculation and analysis of the total allowable error of the whole system as well as the fixed error, random error and system error, the precision design requirement of all axes are calculated and the precision of the machine components are then confirmed. Then, the design methods and processes for the axes and key components are introduced.The principle and design of image alignment system, hydraulic system, pneumatic system and other auxiliary equipments are also introduced. Such auxiliary device basically ensures the reliable operation of the whole machine, which strongly guarantees the realization of the whole machine’s technical targets. In addition, the electrical design of the whole machine is briefly mentioned.Finally, both the test results and the practical using results have proved that the performance of the chip-cutting machine has achieved the desired requirements. The cutted chips has favorable sizes, regular shapes, and good consistency, which shows the overall performance of the machine stand in the leading level of domestic markets and thus well satisfy the demands of domestic semiconductor manufacturers. At the same time, some discussions and suggestions for the future development of automatic grinding-wheel chip-cutting machine are given.The successful development of the automatic grinding-wheel chip-cutting machine improves the quality and efficiency of the IC chip cutting, greatly decreasing the rejection rate of finished products, and reduce the production cost. It ensures the convenient, efficient and reliable production requirements of semiconductor users, and shows extremely high cost performance. In addition, the machine can also be used for the cutting and separation of glass, ceramics, quartz, sapphire and other hard and brittle material, which shows very broad application fields and market demands.